Slit Coating Iimveliso ezincedisayo
Iimpawu zokuSebenza:0.01um Ukuchaneka kwembuyekezo ye-0.01um ye-slit die head jumper joint ingaphakathi kwe-1 micron
I-0.02um Ukunyamezela kwe-runout ye-coating back roller yi-2μm, kwaye ukuthe tye ngu-0.002μm / m.
0.002um/m Ukuthe tye kwe-slit die head lip yi-0.002μm/m.
Uluhlu lweSicelo:
I-Semiconductor photoresist coating, i-dielectric coating, kunye nokufakwa kwefilimu kwishishini le-elektroniki
Ukugqunywa kwezixhobo ze-electrode ezintle kunye nezingalunganga kunye nokufakwa kwe-electrode yebhetri kwishishini elitsha lamandla
Iimpawu zokuSebenza:
Impazamo yokwaleka ubukhulu ilawulwa ngaphakathi ± 3um
ulungelelaniso olulula lwezikrufu
ipleyiti yolwahluli ohambayo, enokumelana nokukhutshwa komoya ophantsi, isantya somoya esifanayo, kunye nokuchaneka kokuya kuthi ga kwi-98%.
Uluhlu lweSicelo:
Ukukhupha amanzi kunye nokomisa iibhodi zesekethe ze-elektroniki (PCB) kunye nemiboniso yekristale engamanzi (LCD/TFT)
Ukucoca iglasi (LCD), ukucocwa kwe-ultrasonic, ukucocwa kwamanzi, kunye nokomisa
Umoya oshushu uvuthuza kushishino lwamalaphu
Iimpawu zokuSebenza:
Unyamezelo lweCylindricity ≤0.002mm
Unyamezelo lwe-Coaxiality ≤0.002mm
Uburhabaxa boMphezulu iRa≤0.05um
Uluhlu lweSicelo:
Ifilimu ekhuselayo yokukhusela imiboniso yeselula / yethebhulethi kunye ne-electrode material coating kwiibhetri ze-lithium kwishishini lombane.
Ukugquma ifilimu ekhuselayo kwimizimba yeemoto
Ukuveliswa kwemveliso ye-Photovoltaic yeebhetri ze-perovskite kunye nedayi - iiseli zelanga ezivakaliswayo.
