Iimveliso eziNcedisayo zokuGcina iSlit Coating
Iimpawu Zokusebenza: 0.01um Ukuchaneka kokubuya kwe-jumper joint ye-0.01um slit die head kungaphakathi kwe-1 micron
0.02um Ukunyamezelana kokubaleka kwe-coating back roller yi-2μm, kwaye ukuthe tye yi-0.002μm/m.
0.002um/m Ukuthe tye komlomo wentloko ye-slit die yi-0.002μm/m.
Uluhlu lwesicelo:
I-semiconductor photoresist coating, i-dielectric coating, kunye ne-film coating kwishishini le-elektroniki
Ukugqunywa kwezinto ze-electrode ezilungileyo nezingalunganga kunye nokugqunywa kwe-electrode yebhetri kushishino olutsha lwamandla
Iimpawu zoKusebenza:
Impazamo yobukhulu bengubo ilawulwa ngaphakathi kwe-±3um
izikrufu zokulungisa kakuhle ukuze kube lula ukuzilungisa
ipleyiti yokwahlulahlula ukuhamba komoya, enokumelana nomoya okuphantsi, isantya somoya esifanayo, kunye nokuchaneka okufika kwi-98%
Uluhlu lwesicelo:
Ukucocwa nokusomiswa kweebhodi zesekethe ze-elektroniki (PCB) kunye nee-liquid crystal displays (LCD/TFT)
Ukucocwa kweglasi (i-LCD), ukucocwa nge-ultrasound, ukususa amanzi, kunye nokomisa
Umoya oshushu ovuthuzayo kwishishini lempahla
Iimpawu zoKusebenza:
Ukunyamezelana kweSilindricity ≤0.002mm
Ukunyamezelana kweCoaxiality ≤0.002mm
Uburhabaxa bomphezulu iRa≤0.05um
Uluhlu lwesicelo:
Ugqumathiso lwefilimu olukhuselayo lwemiboniso yeselula/yethebhulethi kunye nogqumathiso lwezinto ze-electrode kwiibhetri ze-lithium kushishino lwe-elektroniki.
Ugqubuthelo lwefilimu olukhuselayo lwemizimba yeemoto
Ukwenziwa kwemveliso ye-photovoltaic yeebhetri ze-perovskite kunye needayi - iiseli zelanga eziveliswa luluntu.
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